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TVS Diode Arrays (SPA ? Diodes)
Lightning Surge Protection - SRV05 Series
Absolute Maximum Ratings
Thermal Information
Peak Current (t p =8/20μs)
Symbol
I PP
P PK
T OP
Parameter
1
Peak Pulse Power (t p =8/20μs)
Operating Temperature
Value
10
150
–40 to 125
Units
A
W
°C
Parameter
Storage Temperature Range
Maximum Junction Temperature
Maximum Lead Temperature
(Soldering 20-40s)
Rating
–55 to 150
150
260
Units
°C
°C
°C
T STOR
Storage Temperature
–55 to 150
°C
Non-repetitive pulse per waveform on page 3
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
1
Electrical Characteristics (T OP =25 o C)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
Reverse Standoff Voltage
Reverse Voltage Drop
V RWM
V R
I R ≤ 1μA
I R = 1mA
8.0
6.0
V
V
I PP =1A, t p =8/20μs, I/O to GND
Reverse Leakage Current
I LEAK
V R =5V
2
0.1
8.8
0.5
10.0
μA
V
I PP =5A, t p =8/20μs, I/O to GND
Clamp Voltage
1
V C
2
11.5
13.0
V
I PP =8A, t p =8/20μs, I/O to GND
2
13.2
15.0
V
Dynamic Resistance
ESD Withstand Voltage 1
R DYN
V ESD
(V C2 - V C1 ) / (I PP2 - I PP1 )
IEC61000-4-2 (Contact)
IEC61000-4-2 (Air)
±20
±30
0.7
Ω
kV
kV
Diode Capacitance 1
Diode Capacitance 1
C I/O-GND
C I/O-I/O
Reverse Bias=0V
Reverse Bias=1.65V
Reverse Bias=0V
2.4
2.0
1.2
3.0
pF
pF
pF
Notes: 1 Parameter is guaranteed by design and/or device characterization.
2
Repetitive pulse per waveform on page 3.
Clamping Voltage vs. I PP
Product Characteristics
20.0
18.0
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
Lead Plating
Lead Material
Lead Coplanarity
Substitute Material
Body Material
Flammability
Notes :
1. All dimensions are in millimeters
Matte Tin
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL 94 V-0
0.0
1
2
3
4 5 6 7
Peak Pulse Current-I PP (A)
8
9
10
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
? 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/25/13
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